3rd Generation DIP and Mini-DIP-IPM (Dual-in-line Package Intelligent Power Modules)

Features:

• Employing 5th Generation planar IGBT chips with 0.6µm design rule or CSTBT™ technology with superior loss performance
• Ultra compact dual or single-in-line transfer mold package (compatible with 2nd generation)
• Including driver and protection circuitry (UV,SC)
• DIP-IPM with reduction of thermal resistance by 20%
• 2500V_rms isolation voltage
• High-active interface logic direct connection to a 3V or 5V MCU
• Highest reliability and optimised EMI performance
• Available from 3A to 50A/600V for motor ratings from 0.1kW to 3.7kW
• Optional wiht open emitter topology for vector control
• All Mitsubishi DIP and Mini-DIP-IPMs have lead-free terminals
• From January 2006 onwards, all DIP and Mini-DIP-IPMs will be supplied with completely lead-free technology